Packaging

To fully benefit from shrinking structure width of the microchips and their exiting increasing performance the assembly or packaging of the different chips to a full system has to cope with rising demands.

Performance of the microelectronic component comes with often with the speed of the signal transmission. Short transmission distances, fast supply of electrical power and low energy loss is key and the goal for modern chip packaging.

Preventing contamination to attach to wafers, chip dies and packaged system is a contributor to small failure rates in the electronic components operation life. Stability and zero-defect rate is safety relevant e.g. in automotive applications.

artemis control helps you establishing clean conditions for your packaging process. We dedicate our full expertise in contamination assessment, components and process guidance to your application.